chip bead cores design and speci cations are each subject to change without notice. ask factory for the current technical speci cations before purchase and/or use. should a safety concern arise regarding this product, please be sure to contact us immediately. & 1 9 2 $ 3 $ 4 - 5 6 7 8 9 6 10 11 12 noise filter chip type bead core dimensions (mm) 4.5 l3.2 l1.8 3.2 l2.5 l1.6 3.2 l1.6 l1.6 code 4532 3225 3216 product code type size form suf?x packing embossed carrier taping code u part kind features effective noise suppression for power lines and high speed signal lines easy pattern layout on pc board rohs compliant type: exccl, excml low dc resistance 3 to 8 m typical: rated current (3 and 4 amperes) (type: excml) low impedance type: exc3b high impedance for high speed signal line noise increased attenuation 60 -1 a, 120 -0.5 a are achieved by using 1608 size (type: exc3bp) chip bead cores type: exccl excml exc3b type: exccl explanation of part numbers recommended applications digital equipment such as pcs, word processors, print ers, hdd, pcc, cd-roms, dvd-roms. digital audio and video equipment such as vcrs, dvc, cd players, dvd players. ac adapters, and switching power supplies. electronic musical instruments, and other digital equipment. nov. 2012 02
chip bead cores design and speci cations are each subject to change without notice. ask factory for the current technical speci cations before purchase and/or use. should a safety concern arise regarding this product, please be sure to contact us immediately. ferrite core electrode aa h w l product code type material size nominal impedance & 1 form 9 2 $ 3 . 4 - 5 6 7 " 8 9 10 11 6 12 noise filter molded chip type bead core dimensions (mm) 4.5 l1.6 l1.1 3.2 l1.6 l0.9 2.0 l1.25 l0.9 1.6 l0.8 l0.8 code 45 32 20 16 the ?rst two digits are signi?cant ?gure of impedance value and the third one denotes the number of zeros following packing embossed carrier taping (excml16 to 32) code u h part kind embossed carrier taping (excml45) conductor electrode ferrite core e t w l dimensions in mm (not to scale) construction type: excml explanation of part numbers dimensions in mm (not to scale) construction type (inch size) dimensions (mm) mass (weight) [mg/pc.] lwha exccl4532 (1812) 4.50.4 3.20.3 1.80.2 0.50.2 125.8 exccl3225 (1210) 3.20.3 2.50.3 1.60.3 0.50.3 60.5 exccl3216 (1206) 3.20.3 1.60.3 1.60.3 0.50.3 37 type (inch size) dimensions (mm) mass (weight) [mg/pc.] lwt e excml16 (0603) 1.6 0.2 0.8 0.2 0.8 0.2 (0.4) 4.5 excml20 (0805) 2.0 0.2 1.25 0.20 0.9 0.2 (0.5) 10.5 excml32 (1206) 3.2 0.3 1.6 0.3 0.9 0.2 (0.6) 21.5 excml45 (1806) 4.5 0.3 1.6 0.3 1.1 0.2 (0.6) 36.0 nov. 2012 02
chip bead cores design and speci cations are each subject to change without notice. ask factory for the current technical speci cations before purchase and/or use. should a safety concern arise regarding this product, please be sure to contact us immediately. & 1 9 2 $ 3 4 # 5 # 6 7 8 9 ) 10 11 12 noise filter high frequency high attenuation for signal lines b high frequency high attenuation for power lines p dimensions (mm) 1.6 l0.8 l0.8 code 3 multilayer chip type bead core the ?rst two digits are signi?cant ?gure of impedance value and the third one denotes the number of zeros following product code type characteristics size nominal impedance form suf?x packing embossed carrier taping code h inner conductor electrode ferrite core e t w l type: exc3 b explanation of part numbers dimensions in mm (not to scale) construction type (inch size) dimensions (mm) mass (weight) [mg/pc.] lwt e exc3bb (0603) 1.60.2 0.80.2 0.80.2 0.30.2 4.5 exc3bp (0603) 1.60.2 0.80.2 0.80.2 0.30.2 4.5 type part number impedance rated current (ma dc) dc resistance () max. ( ) at 100 mhz tol.(%) 4532 exccl4532u1 115 25 2000 0.1 3225 exccl3225u1 45 2000 0.05 3216 exccl3216u1 25 2000 0.05 4516 excml45a910h 91 3000 0.016 3216 excml32a680u 68 3000 0.012 2012 excml20a390u 39 4000 0.008 1608 excml16a270u 27 4000 0.006 1608 exc3bp600h 60 1000 0.07 exc3bp121h 120 500 0.1 exc3bb221h 220 200 0.3 exc3bb601h 600 100 0.8 exc3bb102h 1000 50 1 ratings category temperature range C25 c to +85 c nov. 2012 02
chip bead cores design and speci cations are each subject to change without notice. ask factory for the current technical speci cations before purchase and/or use. should a safety concern arise regarding this product, please be sure to contact us immediately. frequency(mhz) frequency(mhz) lexcml16a270u (1608) lexcml20a390u (2012) lexcml32a680u (3216) lexcml45a910h (4516) 140 120 100 80 60 40 20 0 140 120 100 80 60 40 20 0 frequency(mhz) frequency(mhz) 140 120 100 80 60 40 20 0 140 160 180 120 100 80 60 40 20 0 140 120 100 80 60 40 20 0 1 10 100 frequency(mhz) lexccl4532u1 (4532) 1000 10000 x r 140 120 100 80 60 40 20 0 1 10 100 frequency(mhz) lexccl3225u1 (3225) 1000 10000 x r 140 120 100 80 60 40 20 0 1 10 100 frequency(mhz) lexccl3216u1 (3216) 1000 10000 x r 1 z 1 , r, x() 1 z 1 , r, x() 1 z 1 , r, x() 1 z 1 , r, x() 1 z 1 , r, x() 1 z 1 , r, x() 1 z 1 , r, x() 1 10 100 1000 10000 1 10 100 1000 10000 1 10 100 10000 1 10 100 1000 10000 x r x r x r x r 1000 z z z z z z z impedance characteristics (reference data) measured by hp4291a O z O : impedance r : resistance x : reactance nov. 2012 02
chip bead cores design and speci cations are each subject to change without notice. ask factory for the current technical speci cations before purchase and/or use. should a safety concern arise regarding this product, please be sure to contact us immediately. 1400 1200 1000 800 600 400 200 0 1 10 100 frequency(mhz) lexc3bb221h (1608) 1000 10000 x r 1400 1200 1000 800 600 400 200 0 1 10 100 frequency(mhz) lexc3bb601h (1608) 1000 10000 x r 1400 1200 1000 800 600 400 200 0 1 10 100 frequency(mhz) lexc3bb102h (1608) 1000 10000 x r 200 150 100 50 0 200 150 100 50 0 1 10 100 frequency(mhz) lexc3bp121h (1608) 1000 10000 x r 1 10 100 frequency(mhz) lexc3bp600h (1608) 1000 10000 x r 1 z 1, r, x() 1 z 1, r, x() 1 z 1, r, x() 1 z 1, r, x() 1 z 1, r, x() z z z z z impedance characteristics (reference data) measured by hp4291a O z O : impedance r : resistance x : reactance nov. 2012 02
chip bead cores design and speci cations are each subject to change without notice. ask factory for the current technical speci cations before purchase and/or use. should a safety concern arise regarding this product, please be sure to contact us immediately. sprocket hole compartment chip component tape running direction t 2 p 1 p 2 p 0 fd 0 f w a b t f c f d e f a w f b packaging methods (taping) standard quantity standard reel dimensions (mm) embossed carrier dimensions (mm) ta ping reel embossed carrier taping part number kind of taping pitch (p 1 ) quantity exccl4532u1 embossed carrier taping 8 mm 1000 pcs./reel exccl3225u1 4 mm 2000 pcs./reel exccl3216u1 excml45a910h 3000 pcs./reel excml32a680u excml20a390u 4000 pcs./reel excml16a270u exc3bh part number a b w f p 1 p 2 p 0 0 d 0 t 2 exccl4532u1 3.60.2 4.90.2 12.0 0.2 5.50.1 8.00.1 2.00.1 4.00.1 1.50.1 2.4 max. exccl3225u1 2.90.2 3.60.2 8.00.2 3.50.1 4.00.1 2.1 max. exccl3216u1 2.00.2 3.60.2 excml45a910h 1.90.2 4.80.2 12.0 0.2 5.50.1 1.8 max. excml32a680u 1.90.2 3.50.2 8.00.2 3.50.1 1.6 max. excml20a390u 1.50.2 2.30.2 excml16a270u 1.00.2 1.80.2 exc3bh 1.00.1 1.80.1 part number 0 a 0 b 0 c 0 de w t exccl4532u1 180.0 0 60.01.0 13.00.5 21.00.8 2.00.5 13.00.3 16.5 max. exccl3225u1 0 9.00.3 13 max. exccl3216u1 excml45a910h 13.00.3 16.5 max. excml32a680u 0 9.00.3 13 max. excml20a390u excml16a270u exc3bh C3.0 nov. 2012 02
chip bead cores design and speci cations are each subject to change without notice. ask factory for the current technical speci cations before purchase and/or use. should a safety concern arise regarding this product, please be sure to contact us immediately. c ab preheating peak heating temperature time recommended soldering conditions recommendations and precautions are described below. pr eheat with a blast of hot air or similar method. use a soldering iron with a tip temperature of 350 c or less. solder each electrode for 3 seconds or less. never touch this product with the tip of a soldering iron. recommended land pattern dimensions in mm (not to scale) safety precautions the following are precautions for individual products. please also refer to the common precautions for noise suppression device shown on this catalog. 1. use rosin-based ? ux or halogen-free ? ux. 2. for cleaning, use an alcohol-based cleaning agent. before using any other type, consult with our sales per son in advance. 3. do not apply shock to chip bead cores (hereafter called the bead cores) or pinch them with a hard tool (e.g. pliers and tweezers). otherwise, their bodies may be chipped, affecting their per for mance. excessive mechanical stress may damage the bead cores. handle with care. 4. store the bead cores in a location with a temperature ranging from -5 c to +40 c and a rel a tive humidity of 40 % to 60 %, where there are no rapid changes in temperature or humidity. 5. use the bead cores within a year (exc3b type: within half a year) after the date of the out go ing in spec tion indicated on the packages. part number a b c exccl4532u1 3 5.4 2.8 exccl3225u1 1.7 4.1 2.1 exccl3216u1 1.7 4.1 1.2 excml45a910h 2.6 to 3 5.5 to 6.5 1.2 to 1.6 excml32a680u 1.6 to 2 4 to 5 1.2 to 1.6 excml20a390u 0.8 to 1.2 3 to 4 1 to 1.2 excml16a270u 0.6 to 1 2 to 3 0.8 to 1 exc3bh 0.8 to 1 2 to 2.6 0.8 to 1 (mm) temperature time preheating 140 c to 160 c 60 s to 120 s main heating above 200 c 30 s to 40 s peak 235 10 c max. 10 s temperature time preheating 150 c to 170 c 60 s to 120 s main heating above 230 c 30 s to 40 s peak max. 260 c max. 10 s recommended soldering conditions for re? ow for soldering (example : sn-37pb) for lead-free soldering (example : sn/3ag/0.5cu) re? ow soldering shall be performed a maximum of two times. please contact us for additional information when used in conditions other than those speci? ed. please measure the temperature of the terminals and study every kind of solder and printed circuit board for solderability be fore ac tu al use. flow soldering flow soldering may cause this product to come off be ca use the a dhesiveness of the product element is low. please consult our sales representative in advance about ? ow soldering. nov. 2012 02
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